Seed panel

ABSTRACT

The present disclosure provides a composite article including at least one seed for planting and a method of forming the composite article. The composite article includes a substrate element and a cover element spaced from the substrate element. An adhesive layer is disposed between the substrate element and the cover element for coupling the substrate element and the cover element to one another. The composite article further includes at least one seed abutting the adhesive layer and disposed between the substrate element and the cover element. The cover element is configured to be separated from the adhesive layer for exposing at least a portion of the seed. The present disclosure also provides a method of forming the composite article and a method of planting the seed.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. Provisional PatentApplication Ser. No. 61/372,696, filed on Aug. 11, 2010, the disclosureof which is hereby incorporated by reference in its entirety.

BACKGROUND

1. Field of the Invention

The subject invention relates to a composite article and morespecifically to a composite article including seed for planting.

2. Description of the Related Art

Supplying plantable seeds with products is generally known in the art.Many of these products include different types of seeds embeddedtherein. For example, various articles formed from paper and/or fibers,such as greeting and transactional cards, have seeds integrated withinthe paper/fibers themselves. Alternatively, removable portions ordecorative elements that include seeds embedded therein may be used toadorn the cards. Still other examples of similar products include dishesand cutlery having seeds embedded therein.

Typically, to plant the seeds, the entire card or product may beplanted. However, planting an entire card or product is generally notdesirable because the message or information disposed on the card willbe lost. Moreover, even if only a portion of the card or productcontains the seeds to be planted, the material surrounding the seedsmust break down before the seeds are able to germinate. Thus, plantingan entire card or product is not desirable. Additionally, waiting forthe material surrounding the seed to break down may delay or evenprevent the seeds from ever germinating. Accordingly, there remains anopportunity to develop an improved article including seeds.

SUMMARY

The present disclosure provides a composite article including at leastone seed for planting and a method of forming the composite article. Thecomposite article includes a substrate element and a cover elementspaced from the substrate element. An adhesive layer is disposed betweenthe substrate element and the cover element for coupling the substrateelement and the cover element to one another. The composite articlefurther includes at least one seed abutting the adhesive layer anddisposed between the substrate element and the cover element. The coverelement is configured to be separated from the adhesive layer forexposing at least a portion of the seed.

The present disclosure also provides a method of forming the compositearticle including the steps of providing the substrate element and anadhesive. The method further includes applying the adhesive to thesubstrate element to form the adhesive layer. The method also includesproviding at least one seed and the cover element. The method stillfurther applying the seed and the cover element to the adhesive layer toremovable couple the cover element over the seed and the substrate layersuch that the cover element may be removed for exposing the seed.

The present disclosure further provides a method of planting the seedwith the composite article coupled to a secondary structure. The methodincludes the step of removing the composite article from the secondarystructure. The method also includes the step of separating the coverelement and the substrate element for exposing the seed. The methodfurther includes the step of disposing at least one of the cover elementand the substrate element and the seed in or on a growing medium toplant the seed.

BRIEF DESCRIPTION OF THE DRAWINGS

Other advantages of the present invention will be readily appreciated asthe same becomes better understood by reference to the followingdetailed description when considered in connection with the accompanyingdrawings wherein:

FIG. 1 is a perspective view of a seed panel with a cover elementpartially peeled off to expose a plurality of seed.

FIG. 2 is a partially cross-sectioned view of the seed panel planted forgerminating the seed.

FIG. 3 is an exploded perspective view of another embodiment of the seedpanel.

FIG. 4 is a perspective view of the seed panel spaced from a cup.

FIG. 5 is a cross-sectional side view of the seed panel disposed withina cup having a recessed bottom.

FIG. 6 is a perspective view of a seed panel being manually removed fromthe cup having a recessed bottom.

FIG. 7 is a perspective view of a seed panel of another embodiment withthe cover element partially peeled off to expose a plurality of seed.

FIG. 8 is a perspective view of another embodiment of the seed panelwith the cover element removed to expose a plurality of seeds.

FIG. 9 is an exploded perspective view of another embodiment of the seedpanel.

FIG. 10 is an exploded perspective view of another embodiment of theseed panel.

FIG. 11 is exploded perspective view of another embodiment of the seedpanel.

FIG. 12 is exploded perspective view of another embodiment of the seedpanel.

FIG. 13 is a perspective view of the seed panel disposed on packaging.

FIG. 14 is a perspective view of another embodiment of the seed panelpartially removed from packaging.

DETAILED DESCRIPTION

Referring to the Figures, wherein like numerals indicate like orcorresponding parts throughout the several views an article comprisingone or more seeds is generally shown at 20. The article 20 is furtherdefined as a seed panel 20 and will hence forth be described as the seedpanel 20.

With reference to FIGS. 1 and 3, the seed panel 20 is a multilayeredstructure comprising a plurality of layers 22. The layers 22 are furtherdefined as a seed layer 24, a substrate element 26, an adhesive layer30, and a cover element 28. The seed panel 20 typically includes atleast one of each of the layers 22. However, the number of layers 22 isnot particularly limited, such that the seed panel 20 may include aplurality of any or all of the layers 22. Any of the layers 22 maycompletely cover or extend beyond adjacent layers 22. Alternatively, anyof the layers 22 may only cover or be in contact with a potion ofadjacent layers 22.

For clarity purposes, as used herein, the term “seed” refers to one seedor a plurality of seeds. The seed layer 24 typically includes aplurality of seed; however use of a single seed will not deviate fromthe scope of this disclosure. It should be noted that the seed is notlimited to any particular type of seed. The seed panel 20 may compriseone or a plurality of the same type of seed. Alternatively, the seedpanel 20 may include a variety of different types of seed. The seed mayinclude, but is not limited to, flower seed, herb seed, grass seed,fruit seed, vegetable seed, and combinations thereof. The type of seedutilized may depend upon the size, shape, or function of the seed panel20. The seed is typically spaced from one another in a random,non-contiguous manner within the seed panel 20. Alternatively, the seedmay be arranged in a contiguous layer such that the seed abut oneanother on the seed panel 20.

The seed panel 20 may define any configuration or size related to adesired application. The seed panel 20 of the present disclosure may beutilized in a variety of applications. The seed panel 20 may be affixedto or otherwise coupled to a secondary article. Examples of thesecondary article includes, but is not limited to, cup bottoms, bookmarks, business cards, cartons, boxes, envelopes, compact disc (CD)sleeves, packaging, bottle hang tags, price tags, other die cutcomponents, or any other application. Alternatively, the seed panel 20may itself be one of the aforementioned articles. In other words, theseed panel 20 may be integrated into the article itself. Bothalternatives will be explained in greater detail below.

The substrate element 26 is typically a semi-rigid material and tends tobe environmentally friendly, i.e., biodegradable, meaning that thesubstrate element 26 will tend to biodegrade. Examples of suitablematerials for the substrate element 26 include, but are not limited to,fiberboard, cardboard, cardstock, paper, fibers, recycled newsprint, andcombinations thereof, or the like. However, the substrate element 26 maycomprise a plastic, a metal, a paper, a polymer, and the like.Additionally, the substrate element 26 may comprise a flexible orpliable material without deviating from the scope of the presentdisclosure.

The adhesive layer 30 is typically disposed on the substrate element 26.As used herein, the terminology “disposed on” describes the adhesivelayer 30 being in direct contact with the substrate element 26, orspaced from the substrate element 26. Preferably, the adhesive layer 30is a pressure-sensitive adhesive. However, any other suitable adhesivemay also be employed. The adhesive layer 30 is not particularly limitedand may include a solid, a gel, or a liquid adhesive. Further theadhesive layer 30 may be a sheet, a film, a gum, or any other structure.Additionally, the adhesive layer 30 may be defined as glue, paste,cement, plaster or the like. The adhesive layer 30 also tends to beenvironmentally friendly, i.e., biodegradable, meaning that the adhesivewill tend to biodegrade. The adhesive layer 30 is typically organic.However it is to be appreciated that the adhesive layer 30 may includeone or more silicones without deviating from the scope of thisdisclosure.

The adhesive layer 30 typically couples the seed layer 24 to thesubstrate element 26. The seed layer 24 is not necessarily in directcontact with the substrate element 26. The seed layer 24 may be spacedfrom the substrate layer. The seed layer 24 typically extends from theadhesive layer 30 and away from the substrate layer. Alternatively, theseed layer 24 may be applied to the substrate element 26 prior to theadhesive layer 30 such that the seed layer 24 is in contact with thesubstrate element 26 and the adhesive layer 30 is applied over the seedlayer 24 for coupling the seed layer 24 to the substrate element 26. Inother words, the seed layer 24 may extend from the adhesive layer 30 andtoward the substrate layer. At least a portion of each seed of the seedlayer 24 remains free of the adhesive layer 30. A portion of each seedwithin the seed layer 24 is exposed when the substrate element 26 and/orthe cover element 28 is removed.

The cover element 28 is disposed on the substrate element 26 and overthe seed layer 24 and the adhesive layer 30 for protecting the seedlayer 24 from damage and to help the seed layer 24 remain secured to thesubstrate element 26. The cover element 28 is typically coupled to thesubstrate element 26 through the adhesive layer 30 in areas not occupiedby the seed layer 24. It is to be appreciated that the cover element 28need not be the outer most layer of the seed panel 20 such thatadditional layers 22 may be disposed on or over the cover element 28.The cover element 28 may be further defined as a release layer, arelease coating, a release paper, wax paper, fiberboard, or any suitablematerial that will allow the cover element 28 to be separated from thesubstrate element 26 for exposing the seed layer 24. The term“separated” includes peeling, prying, tearing, or otherwise detachingthe cover element 28 and the substrate element 26. In variousembodiments, the cover element 28 includes one or more siliconesincluding, but not limited to, polydimethylsiloxanes,organopolysiloxanes, and the like. Alternatively, the cover element 28may include organic and/or inorganic materials. The cover element 28 mayalso comprise a biodegradable material.

As discussed above, the seed panel 20 may define any shape and is notparticularly limited in size. Typically, size and shape are related tothe desired application of the seed panel 20. The cover element 28 maybe peeled away (or may be peelable) from the substrate element 26 forexposing the seed layer 24 adhered thereto. With the seed layer 24exposed, the seed panel 20 may be planted for germinating the seed ofthe seed layer 24, as shown in FIG. 2. Alternatively, when the coverelement 28 is removed, thereby exposing the adhesive layer 30, thesubstrate element 26 and the seed layer 24 may be coupled to thesecondary article or another structure via the adhesive layer 30.

FIGS. 3-7 illustrate one exemplary embodiment of the seed panel 20. Inthis embodiment, the seed panel 20 is adapted to be coupled to a cup 32having a recessed bottom. The cup 32 is not particularly limited and istypically formed from a paper composition for use with hot beverages,such as coffee, tea, cocoa, or the like. However, it should beappreciated that the cup 32 may be used to house any type of substance,including hot and cold beverages or any other substance such as, but notlimited to, oatmeal, soup, cold cereal or a non-edible substance. Thecup 32 may define any shape and size. The cup 32 typically includes agenerally horizontal bottom wall 34 having an inner surface 36 and anouter surface 38 spaced from the inner surface 36. The cup 32 typicallyhas a peripheral wall 40 that is disposed about the bottom wall 34 andthat defines a chamber 42 for housing the substance. The peripheral wall40 includes an upper end 44 and a lower end 46. The upper end 44 definesan aperture 48 for filling and emptying the cup 32. A lid 50 may beplaced over the aperture 48 to enclose the chamber 42 and preventspillage of the beverage. However, the lid 50 is not required. Thebottom wall 34 is proximately spaced from the lower end 46 of theperipheral wall 40 such that the peripheral wall 40 extends beyond theouter surface 38 of the bottom wall 34, and defines a cavity 52 betweenthe lower end 46 and the outer surface 38, with the lower end 46defining an orifice for accessing the cavity 52. In other words, thecavity 52 is not enclosed on all sides such that the cavity 52 has an“open” bottom. The cavity 52 is not particularly limited in size. Whenthe cup 32 is placed on a relatively flat surface such as a table, acounter, or the like, the lower end 46 of peripheral wall 40 typicallysupports the cup 32.

The cavity 52 typically defines a plurality of diameters between theouter surface 38 of the bottom wall 34 and the lower end 46, as bestshown in FIG. 5. The peripheral wall 40 and the outer surface 38 aretypically in an acute angular relationship with one another, such thatthe diameters defined by the peripheral wall 40 decreases, moving awayfrom the bottom wall 34 and toward the lower end 46 of the peripheralwall 40. Said differently, the diameter defined by the peripheral wall40 immediately adjacent the bottom wall 34 is typically larger than thediameter defined by the lower end 46 of the peripheral wall 40. Thediameter defined by the lower end 46 of the peripheral wall 40 isfurther defined as a first diameter D1 and tends to be the smallestdiameter defined by the peripheral wall 40 within the cavity 52. Thediameter defined by the peripheral wall 40 immediately adjacent thebottom wall 34 is further defined as a second diameter D2 and tends tobe the largest diameter defined by the peripheral wall 40 within thecavity 52.

When the seed panel 20 is adapted to be coupled to the cup 32, the seedpanel 20 typically defines a configuration that is approximatelycomplementary in shape to the cavity 52. The configuration has aperimeter 54, and the perimeter 54 defines a third diameter D3. Thethird diameter D3 tends to be less than the second diameter D2, butslightly larger than the first diameter D1 defined by the peripheralwall 40. An interference fit is created between the peripheral wall 40and the seed panel 20 for securing the seed panel 20 within the cavity52. In other words, the seed panel 20 is forced past the first diameterD1 and into the cavity 52 thereby securing the seed panel 20 therein.Alternatively, the seed panel 20 may be glued, fastened, or otherwiseheld in place. It is to be appreciated that the type of attachment ofthe seed panel 20 to the cup 32 is not particularly limited.

Additionally, the seed panel 20 may define a recess 56 along theperimeter 54 with the recess 56 typically defining a substantiallysemi-circular configuration. However, it is to be appreciated that therecess 56 is not particularly limited to a specific shape. As shown inFIG. 6, the recess 56 is typically used to remove the seed panel 20 fromthe cavity 52. A user may insert a finger, or a mechanical device, intothe recess 56 to pry or pull the seed panel 20 away from the bottom wall34, thereby freeing the seed panel 20 from the cavity 52 of the cup 32.After the seed panel 20 is removed from cup 32, the cover element 28 ispeeled from the remaining layers 22 of the seed panel 20 for exposingthe seed layer 24 in preparation for planting, as illustrated in FIG. 7.

With reference to FIGS. 8 and 9, in another embodiment of the seed panel20, the substrate element 26 may be larger than and extend beyond theother layers 22. Specifically, the substrate element 26 may be apackaging 58, such as, for example, a CD sleeve for protecting a compactdisc. The packaging 58 comprises a base 60 and a plurality of wings 62extending from the base 60. The adhesive layer 30 may be applieddirectly onto the base 60 for securing the seed layer 24 thereon. Inthis embodiment, the cover element 28 is removed for exposing the seedlayer 24 and the remaining portions are planted. In other words, thepackaging 58 is planted and is no longer used for protecting the compactdisc.

In yet another embodiment, shown in FIG. 10, the packaging 58 mayinclude a release coating 64. The release coating 64 is illustrated withbroken lines on the base 60 of the packaging 58. However, it is to beappreciated that the release coating 64 in not necessarily required. Theadhesive layer 30 couples the seed layer 24 to the substrate layer andis configured to be peeled away or otherwise removable from thepackaging 58 for exposing the seed layer 24. Said differently, in thisembodiment the packaging 58 functions as the cover element 28 and thepackaging may continue to be used for an intended purpose, e.g.protecting the compact disc.

In still another embodiment, additional layers 22 may be added to theseed panel 20. With reference to FIGS. 11-13, the adhesive layer 30 maybe further defined as a first adhesive layer 30 a and a second adhesivelayer 30 b. Additionally, the cover element 28 may be further defined asa first cover element 28 a and a second cover element 28 b. In thisembodiment, the second cover element 28 b may comprise a rigid or asemi-rigid material. The second cover element 28 b may also include therelease coating 64 on at least one side for facilitating removal fromthe second adhesive layer 30 b, while remaining coupled to the firstadhesive layer 30 a. In other words, the first cover element 28 a maycomprise a different material than the second cover element 28 b. Inthis embodiment, the seed panel 20 is removed from the packaging 58 andthe packaging 58 may continue to be used, e.g. protecting a compactdisc, after the seed panel 20 is removed. It is to be appreciated thatother embodiments the additional layers 22 may not necessarily berequired to allow the packaging 58 to be reused after removal of theseed panel 20.

Referring specifically to FIGS. 11 and 13. The packaging 58 is typicallyformed in a flat state with creases 66 formed between the base 60 andthe wings 62. The wings 62 are folded along the creases 66 and towardthe base 60 to form the three-dimensional structure.

With reference to FIG. 14, the seed panel 20 may include perforations68. The perforations 68 divides the seed panel 20 into a central portion70 and a plurality of outer portions 72. In this embodiment, the seedpanel 20, including the central portion 70 and the outer portions 72 areaffixed to the packaging 58. The central portion 70 may be torn from theouter portions 72 along the perforations 68 to remove the centralportion 70 from the packaging 58. After being removed from the packaging58, the central portion 70 functions as the seed panel 20, as describedabove. The cover element 28 may be peeled away from the substrateelement 26 to expose the seed layer 24 in preparation for planting.

The present disclosure also contemplates a method of forming the seedpanel 20. The method may include the step of providing a substrateelement 26. The method may also include the step of providing anadhesive. The adhesive may be applied, for example, by spraying,rolling, sheeting, filming, etc. The method may also include the step ofapplying the adhesive to the substrate to form an adhesive layer 30. Themethod may also include the step of providing at least one seed. Themethod may also include the step of applying the seed to the adhesivelayer 30. The method may also include the step of providing a coverelement 28. The method may also include the step of applying the coverelement 28 over the seed and substrate element 26. The method may alsoinclude the step of applying pressure to adhere the substrate element 26to the cover element 28 for securing the seed therebetween. The methodmay also include the step of applying heat for promoting adhesion of thesubstrate element 26 and the cover element 28. The method may alsoinclude the step of cutting the composite of the packaging 58 to formthe seed panel 20.

The present disclosure further contemplates a method of planting seedwith the seed panel 20. As described above, the seed panel comprises thesubstrate element 26 and the cover element 28 spaced from the substrateelement 26. The adhesive layer 30 is disposed between and couples thecover element 28 and the substrate element 26 to one another. At leastone seed is disposed between the elements 26, 28 and abuts the adhesivelayer 30. The seed panel 20 may be removably coupled to a secondarystructure. The method may include the step of removing the seed panel 20from the secondary structure. The method may further include the step ofseparating the elements 26, 28 apart to expose the seed of the seedlayer 24. The method may further include the step of soaking the seedpanel 20 in a solution to facilitate separation of the elements 26, 28.The method may further include the step of disposing at least one of theelements 26, 28 having at least one seed disposed thereon in or on agrowing medium to plant the seed. The method may further include thestep of applying water to the seed and growing medium to facilitategermination of the seed. The terms “disposing the elements” may befurther define as placing at least one of the elements 26, 28 with theseed disposed thereon atop the growing medium. Alternatively, the terms“disposing the elements” may be further define as placing at least oneof the elements 26, 28 with the seed disposed thereon within the growingmedium. It is to be appreciated that the growing medium is notparticularly limited, and may include, but is not limited to, soil,dirt, gel, peat, sand, wood residues, hydroponic media, or any othersuitable material.

The invention has been described in an illustrative manner, and it is tobe understood that the terminology which has been used is intended to bein the nature of words of description rather than of limitation.Obviously, many modifications and variations of the present inventionare possible in light of the above teachings. It is, therefore, to beunderstood that reference numerals are merely for convenience and arenot to be in any way limiting, the invention may be practiced otherwisethan as specifically described.

What is claimed is:
 1. A composite article comprising: a substrateelement; a cover element spaced from said substrate element; an adhesivelayer disposed between said substrate element and said cover element foradhering said substrate element and said cover element to one another;at least one seed abutting said adhesive layer; and wherein said coverelement is configured to be separated from said adhesive layer therebyexposing at least a portion of said seed.
 2. The composite article asset forth in claim 1 wherein said cover element comprises a releasablepanel having at least one surface configured to permit separation ofsaid cover element and said adhesive layer.
 3. The composite article asset forth in claim 2 wherein said substrate element and said adhesivelayer remain coupled to said seed after said cover element is separatedtherefrom.
 4. The composite article as set forth in claim 3 wherein saidsubstrate element, said adhesive layer, and said seed are plantable forgerminating said seed.
 5. The composite article as set forth in claim 3wherein said adhesive layer couples said substrate element and said seedto an article.
 6. The composite article as set forth in claim 1 defininga planar sheet.
 7. The composite article as set forth in claim 6 furtherdefining a plurality of creases for allowing said composite article tobe folded into a container.
 8. The composite article as set forth inclaim 1 wherein said substrate element comprises a biodegradablematerial.
 9. The composite article as set forth in claim 1 wherein saidadhesive layer comprises a biodegradable adhesive.
 10. The compositearticle as set forth in claim 1 further including a second adhesivelayer and a second cover element disposed over said second adhesivelayer.
 11. A method of forming a composite article, said methodcomprising the steps of: providing a substrate element; providing anadhesive; applying the adhesive to the substrate to form an adhesivelayer; providing at least one seed; applying the seed to the adhesivelayer; providing a cover element; and applying the cover element overthe seed and substrate element.
 12. The method as set forth in claim 11further including the step of applying pressure to adhere the substrateelement to the cover element for securing the seed therebetween.
 13. Themethod as set forth in claim 11 further including the step of applyingheat for promoting adhesion of the substrate element and the coverelement.
 14. The method as set forth in claim 11 further including thestep of cutting the composite article for forming a seed panel.
 15. Amethod of planting seed with a composite article, the composite articlecomprising a substrate element and a cover element spaced from thesubstrate element, an adhesive layer disposed between and coupling theelements to one another, and at least one seed disposed between theelements and abutting the adhesive layer, with the composite articleremovably coupled to a secondary structure, said method comprising thesteps of: removing the composite article from the secondary structure;separating the elements apart to expose the seed; and disposing at leastone of the elements having a seed thereon in or on a growing medium toplant the seed.
 16. The method of as set forth in claim 15 furtherincluding the step of applying water to the seed for germinating theseed.
 17. The method of as set forth in claim 15 further including thestep of soaking the composite article for facilitating separation of theelements.
 18. The method of as set forth in claim 15 wherein the growingmedium is further defined as soil or dirt.
 19. The method of as setforth in claim 15 wherein disposing at least one of the elements isfurther defined as placing the elements atop the growing medium.
 20. Themethod of as set forth in claim 15 wherein disposing at least one of theelements is further defined as placing the elements within the growingmedium.